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Dicing Tape Line-up ELEP HOLDER®

Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing.

Die Attach Film with Pressure Sensitive Dicing Tape ELEP MOUNT® (EM Series)

Achieves high reliability by combining dicing and die attachment functions.

Solvent Resistance Dicing Tape(Under Development)

Dicing tape with solvent resistance is for special processes like TSV wafers.


V-8AR has an ideal adhesion level to keep the wafer on place during wafer dicing and shows a stable adhesion strength behavior on silicon wafer in function of time. 

The tape has an excellent deformation behavior and elongation to allow ideal stretching during wafer processing. 

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