Technology for creating a conductive nano-order thin film on the surface of a film in a vacuum is used in applications such as flexible printed circuit boards and transparent conductive films for touch panels.
Sputtering Deposition Technology
When high voltage is applied to a target in an Ar atmosphere, a plasma consisting of Ar+ and electrons is formed. Ar+ is accelerated in an electric field, impacts the target, and sputters a target substance. In some cases sputtered atoms are directly deposited onto a bese film, while in other cases where reactive gases, such as oxygen, are added to Ar gas, a compound containing the target substance and oxygen is deposited. An example of the latter is ITO transparent conductive film, which is formed by replenishing oxygen in the In2O3-SnO2 target that has been lost through dissociation.
Forming layers where interference and scattering of reflected light from the surface of optical films occurs prevents the reflection of outside light and makes displays easier to see.
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Anti-Glare Treatment Reflected light is scattered on the surface by micrometer-scale corrugations which are formed by coating the surface with a resin containing dispersed glass or plastic beads. |
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Anti-Reflective Treatment Alternating layers with high and low refractive indices and optical thicknesses are designed so that reflected light from the surface and reflected light from optical interfaces cancel each other out. |
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Sputter Etching Treatment By supplying high RF voltage to the rotary electrode and inducing a discharge, high energy ions impact a film to form minute undulations and add various functional groups to the surface. Modifying the surface in this way improves adhesion. This technology is used in fluororesin adhesive tape. Plasma Treatment By supplying high RF voltage to the lower electrode and inducing a discharge, ions and radicals act on the film surface to add various functional groups to the surface. This technology is employed when forming copper wires on polyimide film. |
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