The Electro conductive Die Attach Film is combined with dicing tape (2 in 1 structure). Electro conductivity is as high as conventional conductive paste. Because of the 2 in 1 structure, the electro conductive die attach film is attached when the dicing tape is laminated on a wafer so that it can reduce the customer’s processes. In addition, the electro conductive die attach film contributes to make the package smaller because the material does not bleed out from the chip edge after die bonding.
Stable pick-up performance thanks to the adoption of the market-proven technology of ELEP MOUNT (die attachment film).
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Business Hours(Australia time)08:30-17:00 Except for Sat, Sun, and Holidays
About NITTO's SupportTEL +61-3-9213-1700
Business Hours(Australia time)08:30-17:00
Except for Sat, Sun, and Holidays
