Cleaning Material for Wafer Chuck Table Cleaning Wafer™

The Cleaning Wafer is for removing small particles on the robot arms or chuck tables of semiconductor-manufacturing equipment.

The Cleaning Wafer, having a special cleaning layer, can remove small particles in the semiconductor manufacturing equipment. Down-time of tools can be drastically reduced by using the cleaning wafer, compared with the ordinal hand cleaning method. The cleaning wafer can also be used for preventive maintenance so that yield improvement can be expected.

Features
Structure/Specification
Applications/Reference

Features

The cleaning wafer has a special cleaning layer which provides excellent cleaning performance and stable transferring performance.
Uses a special particle removal layer that has a high elastic modulus and does not contaminate the chuck table.
Reduction of down-time can be expected for particle cleaning in a vacuum chamber.
Cleaning operation using the cleaning wafer is very simple and easy.
Wide range in particle size can be captured.

Structure/Specification

Item	CW1000
Structure
Total Thickness	720～900 (μｍ)
Surface Hardness	500Mpa (22℃)
Operation Temperature	-20～50℃ ※1
Size	6inch: Oriental Flat 8/12inch: V-notch
Particle Type	Si, Metal (Organic)
Particle Size	0.2μm and over (Measured Value)

※1 Please consult with us if operation temperature is higher than 50°C.

Applications/Reference

	Equipment	Effect
	Dry Etching	Stabilize cooling helium gas
	Dry Etching	Reduce maintenance time
	Prober	Reduce frequency of regular maintenance
	Litography	Reduce vacuum error
		Reduce focus error
		Reduce maintenance time
	Ion implementation	Reduce frequency of regular maintenance
	Types of devices	Target
	Memory/Logic	Dry etcher, Lithography, Stepper
	Power device	Stepper, Prober
	Saw/Baw filter	Dry etcher, Spattering
	MEMS	Dry etcher

Improvement of Downtime

By using CW1000, downtime can be shortened compared to normal chamber cleaning that opens to the atmosphere.
※Can extend the span of time before open atmosphere cleaning.