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Double Sided Tape for Lead-free Soldering, Offering Excellent Heat-resistant and Repulsion Resistant Properties No.585

Ubstrate-included/heat-resistant double sided thin adhesive tape. Double sided adhesive tape with superior adhesion to applications with high repulsive force such as FPC bending.

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Features

  • Superior adhesiveness to applications with high repulsive force such as FPC bending.
  • High shard removal processability/usage during die-cutting process.
  • Can be soldered with the release liner attached. (heat resistant release liner)
  • Double release liner type is also available. (Product: No.585W)

Structure

Properties

180° peeling strength [N/20mm] (to polyimide film)13
Liner peeling strength [N/50mm]0.9
Liner peeling strength after reflow [N/50mm]1.3

[Remarks]

  • Note) Reflow condition: peak temp 250℃
  • * Measured by peeling in a 180° direction at a speed of 300 mm/min with 0.025 mm PET lining.
  • * The figures are a sample of observed values, not guaranteed performance.

Applications

  • Fixing FPC to chassis, fixing reinforcement plates of FPC.
  • Other applications riring heat resistance.

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