• High density
• High dimensional precision
• Metal base

Solder Bump

• A coreless bump is formed with solder paste.
• Can be thermally bound.

Flying Lead

The entire flying lead is Ni-Au plated. Can be bonded by normal temperature ultrasonic wave.

Gold-ball Bonding Pad

Flying Lead

Back Side Pad

[Remarks]

• *SUS is used as the base metal.
• *Double-sided pads are available.
• *The plating on the pad and the flying lead is either Ni-Au or Au.

• Hard disk drive