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Thermal Conduction Sheet with Superior Heat Dissipation and a Remarkable Cooling Effect in Electronic Devices HT Sheet

This thermal conduction sheet is effective for heating and cooling of integrated circuit devices, etc.

Features

  • Provides excellent thermal conductivity using silicon gel as a matrix resin.
  • Excellent fit and stress relaxation for irregular surfaces.
  • A wide range of thicknesses are available to fit various gaps.

Properties

thermal interface structure

Lineup

Type Color Product No. Thickness Stickness Thermal
resistance
[m2K/W]
Thermal
conductivity
[W/Mk]*1
Hardness*2
Gel Black HT-050 0.5 Single-coated 0.50×10 -3 1.0 21
HT-080 0.8 0.82×10 -3
HT-100 1.0 1.04×10 -3

[Extra Info]

  • *1: ASTME-1530 method
  • *2: Asker A-type hardness
          * Measurements provided here are measurement value examples and are not guaranteed.

Applications

・Thermal measures for semiconductor modules, 
   automotive ECU

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Customer Support Center

TEL +65-6879-3811 FAX +65-6274-7432

Business Hours(Singapore time)08:30 to 17:30 Except Sat, Sun & Public Holidays

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Contact Us

Customer Support Center

TEL +65-6879-3811
FAX +65-6274-7432
Business Hours(Singapore time)08:30 to 17:30
Except Sat, Sun & Public Holidays