Heat resistance back grinding tape can correspond to the secondary process of wafer backside. After the back-grinding process, the wafers with the heat resistance back grinding tape can be processed (wet etching, ashing, metalizing, exposure/processing and so on).
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Business Hours(Singapore time)08:30 to 17:30 Except Sat, Sun & Public Holidays
TEL +65-6879-3811
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Business Hours(Singapore time)08:30 to 17:30
Except Sat, Sun & Public Holidays
