Protection Tape Remover from TAIKO™ Wafer NEL SYSTEM™ series

This equipment is full-auto type Tape remover, removes protection tape (for back-grinding process) from TAIKO wafer patterned surface .

HR9000

Full-auto Tape Remover for 200mmTAIKO wafer

Operation flow

Features

TAIKO wafer available
Non-contact transferring by Bernoulli method
Contamination-less transferring (by using Twin arm Robot)
Stable peeling performance by Peeling bar, Peeling trigger, Edge keeper
(Peeling trigger & Edge keeper: Option)
Low stress peeling by partly peeling tape applying
Easy operation by Touch panel & Recipe function
Follow to CE mark / SEMI S2/S8
Adding SECS/GEM available

Basic spesifications

Applicable wafer size：　8 inch／6 inch
Applicable wafer thickness：　TAIKOwafer：50um or more,
Normal wafer: 150um or more
Throughput：　TAIKOwafer：30wafers/hr.
Normal wafer： 50wafers/hr

*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

Back to product category list Back to product detail list

Related products

Protection Tape Applicator for Backgrinding Process

This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

Protection Tape Remover for Backgrinding Process

This equipment removes protection tape from the wafer patterned surface after the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

Protection Tape Applicator (with Vacuum + Pressing function)

This equipment is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.

UV Irradiator for Dicing Process

This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

Wafer Mounter (Full-auto type)

This equipmet is full-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame, and removes protection tape from wafer patterned surface.

Wafer Mounter (Semi-auto type)

This equipmet is semi-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame.

Vacuum Wafer Mounter

This equipment is Wafrer Mounter in vacuum condition. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

Wafer Re-Mounter (MA3000III + Frame removal unit)

This equipment is full-auto type Wafer Re-mounter for 300mm wafer, first removes the frame from wafer-mount-frame by support tape, and next mounts the wafer on the new frame by dicing tape, and removes the support tape from the wafer

See more related products

Contact Us

Customer Support Center

E-mail

TEL +65-6223-8277

Business Hours(Australia time)08:30-17:00 Except for Sat, Sun, and Holidays

About NITTO's Support

Protection Tape Remover from TAIKO™ Wafer NEL SYSTEM™ series

This equipment is full-auto type Tape remover, removes protection tape (for back-grinding process) from TAIKO wafer patterned surface .

HR9000

HR9000

Operation flow

Features

Basic spesifications

Contact Us

Customer Support Center

Contact Us

Customer Support Center

Find Products from Other Categories

Industrial Tape

Optronics

Human Life

New Products/Technologies

Related Information

Nitto Innovation Lab

FAQ about Products