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Heat Resistance Back Grinding Tape

Back-grinding tape with heat resistance is for special heating process after wafer grinding.

Heat resistance back grinding tape can correspond to the secondary process of wafer backside. After the back-grinding process, the wafers with the heat resistance back grinding tape can be processed (wet etching, ashing, metalizing, exposure/processing and so on).

Features

  • Excellent TTV (Total Thickness Variation) performance.
  • High heat resistance for the wafer backside process.
  • Easy peeling off from ground wafers after several kinds of wafer backside processes.

Structure

Applications

  • Wet etching or metalizing process of wafer backside of power devices, discrete devices, etc.
  • Complicated process in backside of wafer, like IGBT etc.
  • Other semiconductor processes which require a certain amount of heating.
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Except for Second Sat of each month, Sun, and Holidays

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