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Low-Dielectric Porous Polyimide FCCL

An Ultra low-loss flexible circuit board materials with air-incorporated polyimide

  • For Thinner high-speed flexible circuit boards
  • For Replacement of coaxial cables with flexible circuit boards

Features

  • PFAS-Free materials with fluoropolymer-Level Performance
  • Ultra-Low Dielectric Constant through Air Incorporation
  • Minimized High-Frequency Signal Loss
  • Good Stability of Dk/Df in Humid Environments

Concept

Air

No Dielectric Loss

Polymer Substrate

Some Dielectric Loss

* Related Material Character: Dielectric constant, Loss tangent

Low-Dielectric Porous Polyimide FCCL

Porous polyimide technology lowers dielectric constant — less signal loss

Structures

LOW-DK POROUS POLYIMIDE CCL(Single)

LOW-DK POROUS POLYIMIDE CCL(Double)

Properties

Items Conditions Properties
Thickness(µm) RT/RH 34
Dielectric constant: Dk RT/RH 1.81
85℃/85％RH 48hr 1.89
24hr -23℃ water soaking 1.94
Loss tangent: Df RT/RH 0.0025
85℃/85％RH 48hr 0.0042
24hr -23℃ water soaking 0.0049

* Dielectric constant and dielectric loss: Measured using the SPDR method (10 GHz)

Applications

For Consumer Communication Devices

High-speed flexible circuit boards for space-constrained designs

  • Smartphone
  • Laptops
  • AR Glasses
  • Wearable Devices

Coaxial Cable Replacement with Flexible Circuit Boards

  • High Performance Computing(HPC) Equipment
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