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Semiconductor Production Process Film NITOFLON™ Release Film for Molding Process MPS Series

MPS series are PTFE release film products for molding process with superior heat resistance and releasability.

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Features

  • Recommended operating temperature range is from -100℃ to 260℃ for continuous use, and can be used even in higher temperature for a short period.
  • Adhesive substances would hardly attached to the film, and even if it attaches, it can be ealisiy removed.
  • Product lineups are Standard type, Low thermal expansion type,  and High-strength/high thermal contraction type.

Structure

Applications

  • Mold release during semiconductor chip resin sealing
  • Releasing from resin
  • Protect mold from sticking excess sealing resin
  • Reduce solvent

Properties

Property Unit (Nitto)PTFE Film t0.05mm
MPS-10 MPS-11 MPS-13
Tensile Strenght MD MPa 50 58 79
TD 40 38 39
Elongation MD 300 258 120
TD 340 351 335
Coefficient of thermal Expansion MD 10-6/℃ 0 33 -527
TD 333 186 219
Surface roughness um 0.27 0.20 Gloss surface 0.24
Matte surface 0.36
Melting Point 370
Usable temperature
(Continuous use)
260
Feature Standard Low Thermal Expansion ・High strength
・High thermal contraction
*This data represents examples of measured values, and not guaranteed values.

Experimental video

Heat Resistance
Sliding Properties
Electrical Insulation
Chemical Resistance
Mold Release Properties
Weather Resistance

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