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Sealing Compound ELEP COAT LSS Series

This moisture-preventing liquid sealant thoroughly protects circuit boards from changes in humidity, temperature, and other environmental factors. ELEP COAT LSS Series.

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Features

It is and insulating / moistureproof coating material that protects the printed circuit board which is most important part of electronic equipment from harsh environments such as outdoor high temperature and high humidity.
  • Offers low Young's modulus, small thermal expansion coefficient, excellent moisture-proofing, waterproofing, insulating, dust-proofing, and protective properties.
  • Features remarkable, reliable adhesion, quick film formation (3 to 15 minutes after application), strong elasticity, and anti-corrosion properties.

Properties

ItemUnitLSS-520MHLSS-540EMeasurement Conditions
Solid content%2540
Solution viscositymPa ·s4001225℃/ 77°F
Young's modulusMPa759.2Tensile speed 0mm/min
Elongation rate%460500Tensile speed 300mm/min
Water-vapor perme abilityg/cm²-day0.0020.003540℃/ 104°F * 90%
Coating thickness:100µm
Volume resistivityΩ·cm3.3 * 10^162.4 * 10^16JIS C2107
Dry to touchmin.515Coating thickness:20µm
[Extra Info]
  • * Measurements provided here are measurement value examples and are not guaranteed.

Applications

  • ELEP COAT is a liquid sealing compound that uses rubber-modified material as its main ingredient.
  • When applied to the component side of a substrate, it thoroughly protects against moisture, dew, dust, and vibration.
  • In addition, this insulating, moisture-proof sealing compound results in very little stress on the components, and has no negative influence on the substrate such as cracks or leakage current.
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Except for Sat, Sun, and Holidays

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