Semiconductor Wafer Tape SWT 10T+

Wafer processing tape designed for semiconductor dicing processes.

SWT 10T+ consists of a clear transparent PVC film coated with a pressure sensitive acrylicbased adhesive manufactured in clean room environment. For easy unwind, the backing of the PVC-film is coated with a silicone release. The product is wound on a plastic core. Rolls are individually packed in a double polyethylene anti-static bag and foreseen with lot number.

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Datasheet

SDS

Datasheet

NBE_SWT 10T+R_EN

SDS

The information contained herein is based on all the documentation, information and data that can be obtained as of the date issued.

However, Nitto Denko Co., provides no warranties or guarantees, express or implied, regarding the accuracy or completeness of the information on contained amount, physical or/and chemical properties, and hazards or/and harm mentioned herein.

As for SDS of products categorized as "Article", Nitto Denko Co., voluntarily creates and releases the SDS for the particular products which frequently receive inquiries.

SDS_NBE_SWT10T+R_ENG

Features
Structure
Properties
Application

Features

Excellent deformation behaviour
Excellent adhesion level
Easy unwind
Recyclable
Clean room product

Structure

Unique blue transparent PVC film
Pressure sensitive acrylic-based adhesive
One-sided siliconised polyester liner

Properties

Adhesive type	Acrylic-based
Film type	PVC film
Total thickness	0.128 mm / 5.03 mil
Adhesion to SI-wafer	1.2 N/20 mm / 5.48 oz/in
Tensile strength MD	90 N/20 mm / 411 oz/in
Elongation MD	270%
Unwind force	0.6 N/20 mm / 2.74 oz/in
Color	Transparent
Impurities content	< 3 ppm

Application

Nitto Semiconductor Wafer Tape SWT 10T+ is an ideal product for processing semiconductor wafers, to be applied on the backside of the wafer (non-active side).

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