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Electronic Devices

Electronic Components

Other Industries

Chip Parts

粘着テープをはじめNitto製品の用途事例を紹介しています。

  1. 1. Sheeting
  2. 2. Laminate/Press
  3. 3. Cut

    For cutting during chip component manufacturing

    Effective for process rationalization

    • Temporary
      fixing
    • Cutting
    • Release
      by heating

    Heat release sheet for temporary fixing during the manufacturing process

    REVALPHA

  4. 4. Baking
  5. 5. Plating
  6. 6. Inspection
  7. 7. Packaging
  8. 8. Shipment

Battery

Positive / negative plates
Device
Gasket

For cell terminal insulation

Useful for improving workability and reliability

PPS base adhesive tape for heat-resistant insulation

No.320A

PP base adhesive tape with excellent anti-solvent properties

No.370 series

For device termination

Useful for improving workability and reliability

PPS base adhesive tape for heat-resistant insulation

No.320A

PP base adhesive tape with excellent anti-solvent properties

No.370 series

For insulating the bottom portion of a cell

Useful for improving workability and reliability

PPS base adhesive tape for heat-resistant insulation

No.320A

Aluminum Electrolytic Capacitor

粘着テープをはじめNitto製品の用途事例を紹介しています。

  1. 1. Aluminum foil / Etching

    For application during process management

    Labels for general nameplates

    DURATACK PT

  2. 2. Formation, cutting

    For splicing aluminum foil

    PP base adhesive tape with excellent anti-solvent properties

    No.370 series

  3. 3 Winding
  4. 4. Device termination

    For device termination

    PP base adhesive tape with excellent anti-solvent properties

    No.370 series

    PPS base adhesive tape for heat-resistant insulation

    No.320A

    Polyimide adhesive tape for heat-resistant insulation

    No.360 series

  5. 5. Dipping
  6. 6. Casing assembly

    For porous ventilation excluding gases

    Fluorine resin porous film for air filters

    TEMISH NTF9000 series

    This thermal conduction sheet is superior in heat dissipating and cooling effect in electronic devices.

    HT SHEET

  7. 7. Processing and taping

    For transporting condensers

    Paper tape for radial type electrical components

    No.744 series

  8. 8. Inspection/Shipping

Rigid Board

Substrate moisture prevention
Terminal masking tape

For prevention of moisture and dust in substrates

Just paint it on to protect substrates from moisture and dust

Moisture prevention, rubber sealant

Sealant featuring quick-dry and flexible capabilities

LSS-520MH

For masking solder plating

Just stick it on to protect from liquid plating

PET-based, plating masking tape

Masking tape featuring excellent chemical resistance and adhesion

N-300

Flexible Printed Circuit Boards

High Density and Precision Flexible Printed Circuit

Super-fine features created from a combination of circuit production technology and designing technology. We will meet the line pitch requirement by utilizing these two processing technologies.

Environmental Harmony Type Halogen-free FPC

An environmentally-friendly halogen free FPC attaining high grade of flame-resistance (under UL94VTM-O) without the use of halogens or antimony as the flame retardant.

Ultra-thin Double-sided FPC

A circuit board which reduces the bias force with a thin base Pl to combine improved flexibility with double-sided micro line processing.

Thin-film Metal Base Board CISFLEX®

Forms a high resolution circuit with photosensitive Pl and semi-additive copper plating on a metal base.

Contact Us

For inquiries about products.

Business Hours(Japan time)
9:00-17:30(Except for Sat, Sun, and Holidays)
Global Site

E-mail

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