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Protection Tape Remover for Backgrinding Process NEL SYSTEM™ Series

This equipment removes protection tape from the wafer patterned surface after the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

HR3000III
HR8500III
HSA840II
RHSA840II

HR3000III

HR3000III

Full-auto Tape Remover for 300mm wafer

Operation flow

Features

FOUP/Open cassette available
Stable peeling performance by Peeling Trigger
Low stress peeling by accurate control of Peeling bar
Easy operation by Touch panel & Recipe function
Log file function standard equipment
Follow to CE mark / SEMI S2/S8
Adding Wafer mapping scanner available
Adding SECS/GEM available

Basic spesifications

Applicable wafer size：　300mm／200mm
Applicable wafer thickness：　100um or more
Throughput：　60wafers/hr.

*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

HR8500III

HR8500III

Full-auto Tape Remover for 200mm wafer

Operation flow

Features

8""/6""/5"" wafer available
4"" wafer handling (Option)
Table heating function
Thin wafer available (TW version)
Easy operation by Touch panel
Follow to CE mark
Adding SECS/GEM available

Basic spesifications

Applicable wafer size：　8/6/5/4 inch
Applicable wafer thickness：　250um or more、　TW version：150um or more
Throughput：　85wafers/hr.　（TW version：68wafers／hr.）

*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

HSA840II

HSA840

Semi-auto Tape Remover for 200mm wafer

Operation flow

Features

8""/6""/5""/4"" wafer available
8""- 4"" wafer handling available by 1 table
Easy operation by Touch panel
Follow to CE mark / SEMI S2/S8"

Basic spesifications

Applicable wafer size：　8/6/5/4 inch
Applicable wafer thickness：　250um or more
Throughput：　App.50sec.／wafer

*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

RHSA840II

RHSA840II

Semi-auto Tape Remover for 200mm wafer

Operation flow

Features

Peeling the protection tape from Wafer-mount-frame
8"/6"/5"/4" wafer available
8" frame available（6" frame: Option）
8"- 4" wafer handling available by 1 table
Peeling protection tape from stand-alone wafer (Option)
Easy operation by Touch panel
Follow to CE mark & SEMI S2/S8

Basic spesifications

Applicable frame size：　8 inch, (6 inch: Option)
Applicable wafer size：　8/6/5/4 inch
Applicable wafer thickness：　100um or more、　250um or more（for stand-alone wafer)
Throughput：　50sec.／wafer

*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

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