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UV Irradiator for Dicing Process NEL SYSTEM™ Series

This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

UA3000Ⅲ

UA3000Ⅲsemicon_backgrinding_img_icon_ce

Full-auto UV irradiator for 300mm wafer

Operation flow

Features

  • 8""/6"" frame available
  • UV irradiation time automatically calculation
  • Irradiation area expand (To Frame area)
  • N2 purge
  • Check mark stamp after UV irradiation
  • Easy operation by Touch panel & Recipe function
  • Log file function standard equipment
  • Follow to CE mark / SEMI S2/S8"

Basic spesifications

 
  • Applicable frame size：　300mm／200mm
  • Applicable wafer size：　300mm／200mm
  • Throughput：　60wafers/hr.
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

UA8400

UA8400semicon_backgrinding_img_icon_ce

Full-auto UV irradiator for 200mm wafer

Operation flow

Features

  • 8"/6" frame available
  • UV irradiation time automatically calculation
  • Irradiation area expand (To Frame area)
  • N2 purge
  • Check mark stamp after UV irradiation
  • Easy operation by Touch panel & Recipe function
  • Log file function standard equipment
  • Follow to CE mark / SEMI S2/S8

Basic spesifications

  • Applicable frame size：　8 inch／6 inch
  • Applicable wafer size：　8/6/5/4 inch
  • Throughput：　TAIKOwafer：100wafers/hr.
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

UM810/UM110

UM810：　Semi-auto UV irradiator for 8" wafer
UM110：　Semi-auto UV irradiator for 6" wafer

Operation flow

Features

  • UV Irradiation timer equipped (Setting range: 0 - 999sec.)
  • N2 purge function
  • UV illuminometer (Option)
  • Irradiation area expand (to frame area) (Option)

Basic spesificatios

  • Applicable frame size：　UM810：8 inch／6 inch UM110：6 inch
  • Applicable wafer size：　UM810：8/6/5/4 inch　UM110：6/5/4 inch
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
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