This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

This equipmet is full-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame, and removes protection tape from wafer patterned surface.

This equipmet is semi-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame.

This equipment is Wafrer Mounter in vacuum condition. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

This equipment is full-auto type Wafer Re-mounter for 300mm wafer, first removes the frame from wafer-mount-frame by support tape, and next mounts the wafer on the new frame by dicing tape, and removes the support tape from the wafer