V-8AR has an ideal adhesion level to keep the wafer on place during wafer dicing and shows a stable adhesion strength behavior on silicon wafer in function of time.
The tape has an excellent deformation behavior and elongation to allow ideal stretching during wafer processing.
 |
| Property | Unit | ELP V-8AR |
| Thickness | [µm] | 75 |
| Adhesion on mirror si-wafer | [N/20mm] | 1.2 |
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