Semiconductor Wafer Processing Tape SWT 10T+R

Wafer processing tape designed for semiconductor dicing processes.

Nitto Semiconductor Wafer Tape SWT 10T+R is designed for semiconductor dicing processes. This product consists of a clear transparent PVC film coated with a pressure sensitive acrylicbased adhesive manufactured in clean room environment. For easy unwind, the backing of the PVC-film is coated with a silicone release. The product is wound on a plastic core. Rolls are individually packed in a double polyethylene anti-static bag and foreseen with lot number.

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Datasheet

SDS

Datasheet

NBE_SWT 10T+R_EN

SDS

The information contained herein is based on all the documentation, information and data that can be obtained as of the date issued.

However, Nitto Denko Co., provides no warranties or guarantees, express or implied, regarding the accuracy or completeness of the information on contained amount, physical or/and chemical properties, and hazards or/and harm mentioned herein.

As for SDS of products categorized as "Article", Nitto Denko Co., voluntarily creates and releases the SDS for the particular products which frequently receive inquiries.

SDS_NBE_SWT10T+R_ENG

Features
Structure
Properties
Application

Features

Excellent deformation behaviour, even with thicker base film
Excellent adhesion level
Easy unwind
Recyclable
Clean room product
REACH compliant

Structure

Pressure sensitive acrylic-based adhesive
Clear transparent PVC film (better visual inspection)
Silicone release coating

Properties

Film type	Plasticized PVC Film
Adhesive type	Acrylic-based
Total thickness	0.130 mm	EN 1942
Carrier thickness	0.120 mm
Adhesive thickness	0.010 mm
Adhesion to Si-wafer	120 cN/20 mm	JIS Z 0237*
Unwind force	60 cN/20 mm	EN 1944
Tensile strength MD	90 N/20 mm	EN 14410
Elongation MD	270 %	EN 14410
Ionic Impurities	< 3 ppm	Ion Chromatography Analysis**
Colour	Transparent
Transport and storage conditions	Temperature 15 to 30°C
Transport and storage conditions	Relative humidity 40 to 75% RH

*Measured on CZ-N Polished Wafer 4 inch (100) 2.5-3.5 (Shinethu Handoutai co.). Peel-off angle 90°.
**(Na+, K+, Cl-, NO2-, NO3-, PO43-, SO42-).

CAUTION: The above are typical values and should not be used in writing specifications.
Details from the test methods are described on the customer product specification.

Application

Nitto Semiconductor Wafer Tape SWT 10T+R is an ideal product for processing semiconductor wafers, to be applied on the backside of the wafer (non-active side).

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