Fluoroplastic (PTFE) Film with Excellent Heat Resistance, Mold Release, Insulation, Chemical Resistance.

Semiconductor Production Process Film NITOFLON™

Thermal Release Sheet for Electronic Component Processing

Tightly adheres and can easily be peeled off just by heating; perfect for temporary fixing.

Multi-purpose Curing Tape

A new type of curing tape suitable for various purposes.

Surface Protective Materials

Masking/surface protection material developed for leading-edge electronics and optical fields.

Surface Protective Materials

Low contamination type developed for surface protective of electronic and optical parts.

Surface Protective Materials

Optical grade protective material with an antistatic property produced in a class 1000 clean environment.

Surface Protective Materials

Surface protective materials with an antistatic properties that are ideal for applications that do not tolerate static electricity such as LCD panels.

Backgrinding Tape Line-up

Low adhesion release and UV release. Outstanding characteristics support the backgrind process of wafer manufacturing.

Die Attach Film with Pressure Sensitive Dicing Tape

Achieves high reliability by combining dicing and die attachment functions.

Solvent Resistance Dicing Tape

Dicing tape with solvent resistance is for special processes like TSV wafers.

Semiconductor Wafer Processing Tape

Wafer processing tape designed for semiconductor dicing processes.

Semiconductor Wafer Processing Tape

Wafer processing tape designed for excellent stability under various conditions of processing.

Semiconductor Wafer Processing Tape

Semiconductor wafer tape for dicing processes

Semiconductor Wafer Processing Tape

Semiconductor wafer processing tape designed for excellent stability under various conditions of processing.

Single Surface Treated Fluoroplastic (PTFE) Film