Semiconductor Wafer Processing Tape SWT 20+R

Semiconductor wafer processing tape designed for excellent stability under various conditions of processing.

Nitto Semiconductor Wafer Tape SWT 20+R is a wafer processing tape designed for excellent stability under various conditions of processing. This product consists of a blue transparent PVC film coated with a pressure sensitive acrylic-based adhesive manufactured in clean room environment. For easy unwind, the backing of the PVC-film is coated with a silicone release. The product is wound on a plastic core. Rolls are individually packed in a double polyethylene anti-static bag and foreseen with lot number.

Download

Datasheet

SDS

Datasheet

NBE_SWT 20+R_EN

SDS

The information contained herein is based on all the documentation, information and data that can be obtained as of the date issued.

However, Nitto Denko Co., provides no warranties or guarantees, express or implied, regarding the accuracy or completeness of the information on contained amount, physical or/and chemical properties, and hazards or/and harm mentioned herein.

As for SDS of products categorized as "Article", Nitto Denko Co., voluntarily creates and releases the SDS for the particular products which frequently receive inquiries.

SDS_NBE_SWT20+R_ENG

Features
Structure
Properties
Application

Features

Excellent deformation behaviour
High adhesion level
Easy unwind
Recyclable
Clean room product
REACH compliant

Structure

Pressure sensitive acrylic-based adhesive
Unique blue transparent PVC film
Silicone release coating

Properties

Film type	Plasticized PVC Film
Adhesive type	Acrylic-based
Total thickness	0.075 mm	EN 1942
Carrier thickness	0.065 mm
Adhesive thickness	0.010 mm
Adhesion to Si-Wafer	100 cN/20 mm	JIS Z 0237*
Unwind force	60 cN/20 mm	EN 1944
Tensile strength MD	55 N/20 mm	EN 14410
Elongation MD	260 %	EN 14410
Impurities content	< 3 ppm	Ion Chromatography Analysis
Colour	Blue transparent
Transport and storage conditions	Temperature 15 to 30°C
Transport and storage conditions	Relative humidity 40 to 75% RH

*Measured on CZ-N Polished Wafer 4 inch (100) 2.5-3.5 (Shinethu Handoutai co.). Peel-off angle 90°.

CAUTION: The above are typical values and should not be used in writing specifications.
Deviations from the test method are described on the customer product specification.

Application

Nitto Semiconductor Wafer Tape SWT 20+R is an ideal product for processing semiconductor wafers, to be applied on the backside of the wafer (non-active side).

Back to product category list Back to product detail list