Semiconductor Wafer Processing Tape SWT 20T+R

Wafer processing tape designed for excellent stability under various conditions of processing.

Nitto Semiconductor Wafer Tape SWT 20T+R is a water processing tape designed for excellent stability under various conditions of processing. This product consists of a clear transparent PVC film coated with a pressure sensitive acrylic-based adhesive manufactured in clean room environment. For easy unwind, the backing of the PVC-film is coated with a silicone release. The product is wound on a plastic core. Rolls are individually packed in a double polyethylene anti-static bag and foreseen with lot number.

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Datasheet

NBE_SWT 20T+R_EN

Features
Structure
Properties
Application

Features

Excellent deformation behaviour, even with thicker base film
High adhesion level
Easy unwind
Recyclable
Clean room product
REACH compliant

Structure

Pressure sensitive acrylic-based adhesive
Clear transparent PVC film (better visual inspection)
Silicone release coating

Properties

Film type	Plasticized PVC Film
Adhesive type	Acrylic-based
Total thickness	0.130 mm	EN 1942
Carrier thickness	0.120 mm
Adhesive thickness	0.010 mm
Adhesion to Si-Wafer	100 cN/20 mm	JIS Z 0237*
Unwind force	60 cN/20 mm	EN 1944
Tensile strength MD	90 N/20 mm	EN 14410
Elongation MD	270 %	EN 14410
Ionic impurities	< 3 ppm	Ion Chromatography Analysis**
Colour	Transparent
Transport and storage conditions	Temperature 15 to 30°C
Transport and storage conditions	Relative humidity 40 to 75% RH

*Measured on CZ-N Polished Wafer 4 inch (100) 2.5-3.5 (Shinethu Handoutai co.). Peel-off angle 90°.
**(Na+, K+, Cl-, NO2-, NO3-, PO43-, SO42-).

CAUTION: The above are typical values and should not be used in writing specifications.
Deviations from the test method are described on the customer product specification.